Final Year Project 2(Hardware) Week11

Title: Troubleshoot and design the new circuit for MicroController

Objectives:

• To create new PCB for Relay and MicroController circuit
• Create PCb by using UV technique

Procedure:

• After so many of troubleshoot, the MicroController circuit are having a bigger problem due to the short circuit.
• Create the new layout of PCB by UV style and etching a new circuit to satisfy the problem

etching using sodium hydrochloride

• After that it needs to be etching by using ferric chloride. Those steps for etcing by using ferric chloride are same before this post.

After etching

After drill

Result and Analysis:

• New Microcontroller circuit are done and function well. The LCD are replace with the new one.
• The relay circuit are also etching with the new one to make sure that the connction for PCB are success enough.

new design relay PCB

Conclusion:

• The objectives to create a new PCB design are achieve. The main reason to create new PCB are easy to troubleshoot and can compare the effectiveness of the circuit between old and new PCB design.

Final Year Project 2( Hardware) Week10

Title: Troubleshoot the PCB circuit

Objectives:

• To recognize the problem regarding the PCB for Microcontroller  and Relay circuit
• To make sure that the voltage drop at relay circuit are decrease

Procedure:

• Construct the relay connection at bread board and test the connection by using the transistor TIP122. 
• After test, the relay are functioning well and proceed to the next step.
• Checking the LCD connection to make sure that the all the circuit can function well.

Result and Analysis:

• MicroController circuit are function well, but the relay circuit are having some problem. By through this session it must be a some problem that needs to be solved immediately to make sure this project are possible to success. 

Conclusion:

• This week are fully with stressed and really exhausted because the circuit cannot function well as wanted. Needs to do some troubleshoot process more and rearrange the layout of PCB. Also to study again about the connection from MicroController to Relay connection.

Final Year Project 2(Hardware) Week9

Title: Tested the real PCB circuit

Objectives:

• Build the circuit for relay part and MAX232
• Test the both MicroController PCB and relay PCB 

Procedure:

• The relay and MAX 232 circuit needed to be etching first

Before Etching

Relay & MAX232 PCB

• The LCD cables need to be soldering before it fit into the MicroController PCB

Step 1

Step 2

Step 3

Step 4

Step 5

• Step 1 until step 4 are shown that the step needs to be taken to create LCD connection to build to the MicroController PCB. While Step 5 are shown all the limit switches and variable resistor are done soldering.  

Result and Analysis

• After all the component are done soldering, its time to put all the component into its position and test it. 

LCD corrupted

VDD and VSS jumper

• The circuit for MicroController are fully done, after put the supply the LCD didn't show any result. This is because of the LCD failure to operate well. LCD needs to replace with another LCD. And then, the MicroController circuit needs to added some jumper to make sure the current are fully supported

• The LCD are shown the feedback and all the main circuit for MicroController are function well. Then, connected with GSM Wavecom and connected with the relay circuit at (breadboard).

Conclusion:

• All the PCB are designed and tested, the MicroController circuit are function well but the relay & MAX232 circuit are difficult to tested because the voltage drop at relay coil are about 2.7V that cannot trigger the 5VDC relay
• While, the GSM Wavecom are function well with the MicroController circuit and can sent and receive the message tthrough the mobile phone.

Final Year Project2 (Hardware) Week8

Title: Create the real PCB to make a virtual circuit

Objectives:

• Recheck all the PCB layout 
• To create the virtual circuit for Microcontroller circuit and relay circuit

Procedure:

• List all the component that are involved in this session. The component were:

PCB(fibre),masking tape,transparent paper PCB

PCB pen

acid etching

• The PCB (fibre) needed to be printed by using the transparent paper as shown in figure below:

          This step are using the iron to heat up the transparent paper that have printed with the circuit                          MicroController diagram. 

After iron the transparent paper

• The circuit diagram that are appear at the PCB fiber are not cleared enough, so it must be touch up by using the PCB pen as shown as figure below:

Cleared PCB printed

• After that, the PCB must be included the etching processes. The purpose of this processed are to remove the unwanted copper to create a circuit diagram. This step are using the etching acid and hot water. Just shown as Figure below:

Step1: put the etching powder into the plastic bowl

Step2: Put boiled water to the etching powder

Step3: Put the PCB into the bowl

Step4: Etching process end

• The PCB are settled with etching processed. Next, needs to clean up the black ink color at the top of the copper circuit line:

After cleaning

• Drilling process are required to put the component into the PCB:

Drilling process

Put component to PCB

Result and Analysis:

• The PCB for MicroController are designed well. All component such as PIC16F887,Crystal 20Mhz,connector,resistor,voltage regulator 7805,capacitor 22pF and resistor 1K & 47K.
• The component needs to be solder so that the component will conduct electricity very well.

Conclusion:

• The PCB for Microcontroller circuit are designed well. Next, it will be tested after all the component are ready enough to put into the PCB. 
• LCD 16x2 needs to be solder properly to connected into this board.
• Next, etching the relay circuit and tested both circuit.